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It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.
By using a twin-arm robot, efficient operation has become possible, allowing for processing in a short time. Measurement data is automatically saved in an Excel file.
This is a device that measures the thickness of sapphire wafers and sorts them according to their thickness.
By sorting, we prevent wafers with abnormal thickness from flowing into the next process. By measuring the thickness before and after wafer processing, we can also manage the processing conditions. Additionally, by standardizing the thickness for each cassette, the processing quality in the next step is improved.
It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.
By having two discharge stages, short processing times have become possible. Measurement data is automatically saved in an Excel file.
It is a device that measures the thickness of silicon wafers and rearranges them according to their thickness.
By making the stage three-tiered, it has become possible to process more wafers. Measurement data is automatically saved in an Excel file.
